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无铅焊膏印刷模板开口设计推荐规范
■宽厚比=开口的宽度(W)/模板的厚度(T)>1.6
■ 面积比=开口面积(LXW)/孔壁的面积[2*(L+W)*T]>0.71
1． 一般印焊膏模板开口尺寸及厚度
|
元件类型 |
PITCH |
焊盘宽度 |
焊盘长度 |
开口宽度 |
开口长度 |
模板厚度 |
宽度比 |
面积比 |
|
PLCC |
1.27mm |
0.65mm |
2.0mm |
0.60mm |
1.95mm |
0.15-0.25mm |
2.3-3.8 |
0.88-1.48 |
|
(50mil) |
(25.6mil) |
(78.7mil) |
(23.6mil) |
(76.8mil) |
(5.91-9.84mil) |
|||
|
QFP |
0.635mm |
0.635mm |
0.635mm |
0.635mm |
0.635mm |
0.635mm |
1.7-2.0 |
0.71-2.0 |
|
(25mil) |
(13.8mil) |
(59.1mil) |
(11.8mil) |
(57.1mil) |
(5.91-7.5mil) |
|||
|
QFP |
0.50mm |
0.254-0.33mm |
1.25mm |
0.22-0.25mm |
1.2mm |
0.125-0.15mm |
1.7-2.0 |
0.69-0.83 |
|
(20mil) |
(10-13mil) |
(49.2mil) |
(9-10mil) |
(47.2mil) |
(4.92-5.91mil) |
|||
|
QFP |
0.40mm |
0.25mm |
1.25mm |
0.2mm |
1.2mm |
0.10-0.125mm |
1.6-2.0 |
0.68-0.86 |
|
(15.7mil) |
(9.84mil) |
(49.2mil) |
(7.87mil) |
(47.2mil) |
(3.94-4.92mil) |
|||
|
QFP |
0.30mm |
0.20mm |
1.00mm |
0.15mm |
0.95mm |
0.075-0.125mm |
1.50-2.0 |
0.65-0.86 |
|
(11.8mil) |
(7.87mil) |
(39.4mil) |
(5.91mil) |
(37.4mil) |
(2.95-3.94mil) |
|||
|
0402 |
|
0.50mm |
0.65mm |
0.45mm |
0.6mm |
0.125-0.15mm |
|
0.84-1.00 |
|
|
(19.7mil) |
(25.6mil) |
(17.7mil) |
(23.6mil) |
(4.92-5.91mil) |
|||
|
0201 |
|
0.25mm |
0.40mm |
0.23mm |
0.35mm |
0.075-0.125mm |
|
0.66-0.89 |
|
|
(9.84mil) |
(15.7mil) |
(9.06mil) |
(13.8mil) |
(2.95-3.94mil) |
|||
|
BGA |
1.27mm |
φ0.80mm |
|
φ0.75mm |
|
0.15-0.20mm |
|
0.93-1.25 |
|
(50mil) |
(31.5mil) |
|
(29.5mil) |
|
(5.91-7.87mil) |
|||
|
U BGA |
1.00mm |
φ0.38mm |
|
φ0.35mm |
0.35mm |
0.115-0.135mm |
|
0.67-0.78 |
|
(39.4mil) |
(15.0mm) |
|
(13.8mil) |
(13.8mil) |
(4.53-5.31mil) |
|||
|
U BGA |
0.50mm |
φ0.30mm |
|
φ0.28mm |
0.28mm |
0.075-0.125mm |
|
0.69-0.92 |
|
(19.7mil) |
(11.8mm) |
|
(11.0mil) |
(11.0mil) |
(2.95-3.94mil) |
|||
|
Flip Chip |
0.25mm |
0.12mm |
0.12mm |
0.12mm |
0.12mm |
0.08-0.10mm |
|
1.0 |
|
(10mil) |
(5mil) |
(5mil) |
(5mil) |
(5mil) |
(3-4mil) |
|||
|
Flip Chip |
0.20mm |
0.10mm |
0.10mm |
0.10mm |
0.10mm |
0.05-0.10mm |
|
1.0 |
|
(8mil) |
(4mil) |
(4mil) |
(4mil) |
(4mil) |
(2-4mil) |
|||
|
Flip |
0.15mm |
0.08mm |
0.08mm |
0.08mm |
0.08mm |
0.025-0.08mm |
|
1.0 |
2． Chip件开口修改方案
3． IC开口修改方案
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4．制造方法：一般采用激光切割加电化学抛光（Laser + Electroplish ）工艺。如果开口宽厚比和面积比接近门限值，建议采用电铸(Electroform)工艺制造。
